7-14-2751. Use of bonds to make payment of costs. When improvement is ordered upon a petition specifying the method of payment of bonds, the board shall provide that the payment of costs and expenses be made under the provisions of this part by bonds charged against the lands in the district. The bonds may be issued to the contractors in payment, or costs may be paid by the proceeds of the bonds to be issued and sold as hereinafter provided. In all other cases, the board may so provide.
History: En. Sec. 5-422, Ch. 197, L. 1965; R.C.M. 1947, 32-3122.